We are an integrated specialist in PI materials and ultra fine-line flexes manufacturing.

With many years of R&D expertise in PI (Polyimide) applications, our company provides advanced flexible circuit board solutions through our proprietary PI film metallization and SAP/mSAP semi-additive processes. Our products are widely used in AR key components, MicroLED display technologies, medical electronic devices, and flexible Flip Chip IC packaging.

Fine-line precision, ultra-narrow spacing, and high copper thickness — enabling more compact designs, fewer layers, and unbeatable FPC cost advantages.